ACCELERATOR FOR EPOXY CURING-- SUBSTITUTED UREA
GLOCproduct seriesis a latent accelerator, based on a substituted urea, for thermosetting epoxy curing systems, well combined with Dicyandiamide hardeners. GLOCcan help to lower the curing temperature to 120℃and speed up the curing process. It’s ideal for 1k epoxy systems c
产品描述
GLOC product series is a latent accelerator, based on a substituted urea, for thermosetting epoxy curing systems, well combined with Dicyandiamide hardeners. GLOC can help to lower the curing temperature to 120℃ and speed up the curing process. It’s ideal for 1k epoxy systems curing at elevated temperature while maintain
Product | Particle Size | Melt Point | Description | |
1 | GLOC-200 | 98%≤10μm | ≧155℃ | Standard type (chlorine containing) |
2 | GLOC-300 | 98%≤10μm | ≧125℃ | Standard type (halogen-free system) |
3 | GLOC-400 | 90%≤15μm | ≧220℃ | High storage stability/ moisture resistant/ halogen free system/ used as a curing agent |
4 | GLOC-500/550 | 90%≤15μm 98%≤10μm | ≧180℃ | Fast curing type/ halogen free system/ used as a curing agent |
5 | GLOC-700 | 98%≤10μm | ≧178℃ | Long latency |
Application area : fiber composite prepreg, ink, powder coating, structural adhesive, potting adhesive, epoxy FRP.
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